国家/地区 中国（3）
IPC部 C（3）
IPC大类 B01（2） C07（2）
IPC小类 B01J（2） C07C（2）
IPC C07C015/08（2）
发明人 YAN C（3）
公开年 2023（3）
申请年 2023（3）
专利权人 WEIFANG HONG.（2）

High thermal conductivity electromagnetic shielding material module used for e.g. chip, comprises heat conduction layer, and heat dissipation layer, where heat conduction layer is polymer heat conduction adhesive film, and heat dissipation layer is copper foil, aluminum foil or graphite sheet.

YAN C, LI W, SUN X, ZHAO Z

Preparing high-purity m-xylene comprises e.g. contacting the mixed xylene with the adsorbent, discharging the raffinate, then contacting the desorbent with the adsorbed adsorbent, mixing the first part of m-xylene with the second part of m-xylene, cooling, crystallizing, and washing.

XIE P, YAN C, MENG L, FANG X, PAN Y, LI Z, XU X, LIU X

Producing o-xylene comprises e.g. catalyzing 3-nitro-o-xylene by hydrogenation catalyst to generate 3-amino-o-xylene, hydrogenating into o-xylene and ammonia gas under catalytic action of hydrogen decomposing catalyst, absorbing ammonia gas by acid solution, and obtaining high-purity o-xylene.

JIA X, GAO X, FANG X, PAN Y, LIU X, XIE P, XUN Q, YAN C