国家/地区 韩国（3）
IPC部 H（3）
IPC大类 H05（3） C09（2）
IPC小类 H05K（3） C09J（2）
IPC H05K007/20（3） C09J011/04（2） C09J201/00（2）
发明人 KIMTAEHAN（3）
公开年 2023（3）
申请年 2021（2） 
专利权人 PURE MANN IN.（3）

Vapor chamber for use in e.g. electronic device, has sealing parts formed along edges of opposite surfaces of upper and lower plates, and porous metal fiber sheet provided between upper plate and lower plate and filled with low boiling point fluorohydrocarbon.

HUN L S, KIMTAEHAN

Heat dissipation graphite sheet useful in producing mobile phones and thin portable products comprise heat dissipation layer containing urethane resin, and expanded graphite particles applied to one surface of graphite layer.

KIMTAEHAN, KWON H J, CHOI S, SHIM Y, SONG J, YUMINSOOK

Electromagnetic wave shield heat dissipation adhesive sheet useful for electrical and electronic devices e.g. semiconductor chips, and chargers comprises heat dissipation layer, electromagnetic wave shielding layer and adhesive layer.

KIMTAEHAN, HUN L S, SONG J, CHOI S, YUMINSOOK, YOUK S K, SHIM Y