国家/地区 韩国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4） C08L（3） C08G（2）
IPC C08K003/04（4）
发明人 KIM H J（2）
公开年 2023（4）
申请年 2021（2） 
专利权人

Composition used for forming film heater, comprises binder resin containing resol phenolic resin, conductive particles comprising carbon nanotubes, adhesion enhancer comprising polyvinyl acetal, and heat resistance enhancer comprising silsesquioxane powder.

KIM Y J, YOU G J, JANG S H, KIM H J, PARK G H, HONG B K, YOONJIN K, YU G, HYUN C, PARK K H

Piezoresistive composition used to manufacture piezoresistive composite for three dimensional printing and sensor devices, comprises metal-nanocarbon composite particle, polymer e.g. thermoplastic elastomer and organic solvent.

CHOI H J, LEE M, SONG K, PARK S W

Photocurable composite resin useful in preparation of additive, comprises metal particles, ceramic particles, and carbon-based particles and phenol novolac resin containing substituted tricyclic compound.

KIM H J, YANG S W

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K