国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08K（7）
IPC C08K003/36（7）
发明人 LI W（2）
公开年 2023（7）
申请年 2022（6） 
专利权人

Preparing high-temperature-resistant flame-retardant expanded polystyrene foam board comprises uniformly mixing and stirring to become main ingredient including melamine resin, and high temperature resistant filler, and pasting the two load-bearing boards on both sides of the composite board.

HE Y, RUAN X

Black photovoltaic backplane for preparing photovoltaic cell, comprises photovoltaic backplane substrate, black coating and protective layer stacked in sequence.

FENG Z, LU S, WANG Y

Polymer layer derived composition useful in a display device, comprises e.g. polyborondimethylsiloxane, benzoyl peroxide, fumed silica, glass fibers, glass powder, carbon nanotubes, graphene oxide, carbonyl iron, calcium carbonate, zinc oxide, silicone elastomer and polydimethylsiloxane.

HWANG S, LEE J, WU X, KIM J, KIM Y, SHIN H, YU W, YU W R, SHIN H J, SONG K Y, KIM J S, OH H J

Rubber composition useful for preparing sealing strips, comprises e.g. ethylene-propylene diene monomer rubber, silicon dioxide, anti-aging agent, vulcanizing agent, and silicon dioxide surface-modified compound.

HUA H, LI W, WANG J

Polyvinyl chloride regenerated polyvinyl chloride plastic useful for air conditioner, comprises polyvinyl chloride plastic base material covered with woven carbon fiber layer and flame-retardant heat-resistant layer, and woven carbon fiber layer adhered on polyvinyl chloride plastic base material.

ZHANG L, PAN J

Photovoltaic backboard used in photovoltaic module, comprises weather-resistant layer, base material layer, black reflecting layer comprising organic pigment, and barrier layer comprising high barrier composition containing polymer resin, nano material and additive.

ZHOU G, LIN W, LI N

Film-coated board comprises anti-corrosion bottom sequentially, metal plate, hot melt adhesive film and polymer waterproof coiled material, high molecular waterproofing membrane and hot-melt adhesive film are respectively added with silicon micropowder.

ZHENG C, LI W, LI Z, HE M