国家/地区 中国（4）
IPC部 C（4）
IPC大类 C09（4） C08（2）
IPC小类 C09J（4）
IPC C09J011/04（4）
发明人
公开年 2023（4）
申请年 2022（4）
专利权人

Thermally-conductive pressure-sensitive adhesive useful in preparing thermally-conductive pressure-sensitive adhesive film, and in power batteries of energy vehicles, comprises epoxy resin composition, acrylate copolymer, thermally-conductive filler, curing agent, and photoinitiator.

JIANG B, ZHANG Z, YU D

Preparing high-reliability epoxy resin absorbing adhesive film with controllable fluidity by mixing epoxy resin matrix and toughener to compound epoxy resin system, placing epoxy resin system, absorbent, and inorganic filler into resin internal mixer for banbury rough mixing and fine mixing.

GONG Y, LIU J, LI M, LI Y, LV T

Flame retardant modified epoxy resin adhesive film useful in technical field of high molecular materials, aerospace, electronic device, traffic transportation, building material, and defense military industry, comprises e.g. phosphabicyclo-triazine derivative modified graphene and epoxy resin.

WANG S, WANG C

High heat-conducting adhesive tape comprises rubber, epoxy resin, heat conducting agent, dispersant, antioxidant, curing agent, coupling agent, Graphite and nitride.

JIANG X, LIN Y, ZENG H, QIAN X