国家/地区 美国（5）
IPC部 B（5）
IPC大类 B23（5）
IPC小类 B23K（4） C23C（3） C22C（2）
IPC B23K035/26（2） C22C013/02（2）
发明人
公开年 2023（5）
申请年 2022（4） 
专利权人 SAMSUNG ELEC.（2）

Solder composition used in solder joints of printed circuit boards, comprises a compound layer comprising an alloy of bismuth and tin, and a graphene coating positioned on the compound layer.

AURONGZEB D M

Chuck assembly used in semiconductor device fabrication system, comprises chuck base includes lower base and upper base that is on lower base, ceramic plate on upper base, and isolator ring enclosing outer sidewall of lower base.

JUNG U, SHIN M, SUNG D, NA D, KIM D, KIM K, JEONG S, JUNG S H, KIMKYUNGSUN, KIM D W, SUNG D Y, SU S M, JUNGUNGYO

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Fluid system component used in fluid transport, fluid control, fluid operations has body containing multidimensional shape defined in orthogonal directions and layers stacked along one of directions.

MARYA M, ZOLFAGHARI A, KARUPPOOR S S

Manufacturing additive layer used for making particulate and particulate feedstock, involves receiving particulate at chemical vapor deposition reactor, flowing hydrocarbon gas into CVD reactor, decomposing hydrocarbon gas in CVD reactor, depositing carbonaceous coating on particulate.

SCHMIDT W R, ELWARDANY T I, SHE Y, SHARON J A