国家/地区 中国（3）
IPC部 B（3）
IPC大类 B24（3） C09（2）
IPC小类 B24D（3） B24B（2） C09D（2）
IPC B24D018/00（3）
发明人
公开年 2023（2）
申请年 2022（3）
专利权人

Preparing high abrasion resistance chemical mechanical polishing pad used for production of semiconductor chips, by mechanically dispersing filler and surfactant in organic solvent to obtain dispersion, adding resin solution to dispersion, stirring and coating on transparent film coiled material.

YAO L, CHEN H, XIANG H

Grinding pad useful for photo-catalytic auxiliary chemical mechanical polishing, comprises grinding layer and backing layer, comprising liquid resin bonding agent, reactive diluent, grinding material, filler, photocatalyst, curing agent, initiator and other auxiliary agent.

ZHAO Y, DING Y, QIN F

Hardening method of superfine steel ball grinding abrasive tool comprises spraying adhesion layer material, grinding layer material and abrasive sizing agent on abrasive tool surface, cleaning the surface of the abrasive body by ultrasonic waves and subjecting to a roughening treatment.

TANG X, WANG X, WANG H, SUN Q, SHI L, ZHANG Y