国家/地区 中国（8）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08G（8）
IPC C08L063/00（8）
发明人 LIU L（2） XU Y（2） ZHANG Y（2）
公开年 2018（7）
申请年 2018（8）
专利权人

Graphene microsphere/epoxy resin composite material has hexagonal honeycomb structure, and includes graphene microspheres, epoxy resin and curing agent.

ZENG X, LI C, SUN R, ME Y

Composite material contains epoxy resin, butadiene rubber, terminal carboxylated nitrile rubber, stearic acid, sulfur, N-cyclohexyl-2-benzothiazolesulfenamide, nano titanium dioxide, graphene oxide, and hexaphenoxycyclotriphosphazene.

LI X

Graphene-based PCB copper-clad plate, comprises copper-clad laminate prepreg, copper foil and prepreg, and a layer of chemical vapor deposited graphene between copper foils.

ZHANG J, ZHANG Y, XU Y, FENG S, WANG Q

Preparing graphene toughened resin-based carbon fiber composite material comprises e.g. ultrasonically dispersing graphene and the low-viscosity reactive dispersant, mixing dispersion with resin, drying, pressing and curing.

LIU L, LI A, PENG Y, ZHANG F, ZHANG Y, SHI L

Preparing graphene-doped fluorine-containing silicon acrylate polymer packaging material comprises e.g. adding nonylphenol ethoxylate into deionized water, heating, dispersing, removing emulsion and vacuum defoaming.

CHE C

Preparation of flame retardant graphene-modified epoxy resin nanocomposite material by preparing graphene oxide, preparing cage-like octa(3-aminopropyl)silsesquioxane, and preparing functionalized graphene; and graphene-modified epoxy resin.

ZUO D, LIU H, XU X

Silicone epoxy resin composition comprises epoxy-modified silicone oil, bisphenol-A type epoxy resin, epoxy resin curing agent, transparent glass particles, hydrophobic fumed silica and graphene powder.

LIU S

New phosphorus-nitrogen-containing silicon polymer modified graphene oxide flame retardant.

DAI L, LI M, WANG S, HONG J, LIU L, XU Y, YUAN C, CHEN G, ZENG B, LUO W