国家/地区 中国（8）
IPC部 C（8）
IPC大类 C09（8）
IPC小类 C09J（8）
IPC C09J011/04（8）
发明人 LI X（2） LUO W（2） WANG L（2）
WANG R（2）
公开年 2021（7）
申请年 2020（8）
专利权人

Preparing hydroxypropyl carbon silicon organic fiber slurry useful for paving decorative surface construction, comprises e.g. taking grain straw powder, calcium carbonate powder, graphene and carbon black powder.

GUO J

Preparing high-performance conductive adhesive involves combining polydimethylsiloxane, acrylonitrile styrene (AS) resin, polyvinyl formal resin, butadiene rubber, ethanol, tributyl phosphate, methylene diamine, azobisisobutyronitrile.

ZHANG H, QIU H, YU Y

Preparation of adhesive, involves using pressure-sensitive latex, silane coupling agent, modified neoprene latex, ethylene-vinyl acetate copolymer emulsion, defoamer, thickener, deionized water, and fluorinated graphene.

WANG R

Endothermic adhesive film used as bonding material of bulletproof board, comprises film base made of film adhesive and heat-conducting material.

TIAN K, LI X, JI C, DUAN Y, CHEN X, GE A, WANG Q, ZHANG J, LI Y, WANG L, ZHAO Y

Graphene fire-retardant and flame-retardant sealant comprises a fire-retardant base material, and the fireproof rubber base material includes room temperature vulcanized methyl silicone rubber and dimethyl silicone oil.

LUO W, XU B, LI X

Preparation of industrial silicone sealant involves adding alpha,omega-dihydroxy polydimethylsiloxane, flame retardant and high-temperature-resistant filler, kneading, adding crosslinking agent, catalyst and coupling agent, and stirring.

WANG B, LUO W, CHEN H, DENG G, LI C, HUANG R, LIANG Q, YANG X, WANG L, REN C

Film used for chip shielding and heat conduction, comprises a metal film layer, a conductive pressure sensitive tape, a phase change thermal conductive adhesive, and an insulating tape.

MA H, WANG H, GUO C, CHEN J

Insulating thermal conducting adhesive material comprises adhesive main body and insulating thermal conducting filler which is graphene structure composite material modified with boron nitride.

GU Z, WANG R, ZHOU K, CHEN Q