国家/地区 中国（4）
IPC部 C（4）
IPC大类 C09（4）
IPC小类 C09J（4）
IPC C09J011/04（4）
发明人 CHEN Y（4）
公开年 2021（2）
申请年 2021（2） 
专利权人

Antistatic conductive adhesive for circuit board, comprises nano-silver/functionalized graphene hybrid conductive filler, siloxane resin, catalyst, reinforcing agent, inhibitor and crosslinking agent, where siloxane resin is composed of vinyl silicone oil and vinyl MQ silicon resin.

ZHOU F, ZHU J, PAN Y, CHEN Y

Non-hydrogel flexible electronic packaging material used in embedding flexible electronic circuit device, comprises low volatility non-water filling medium, organic silicon copolymer, vinyl silicon oil, modified nano filler and crosslinking agent.

ZHOU R, ZENG J, LUO Y, YE S, CHEN Y, GONG J, HE J

Organic thermal grease comprises silicone oil, thermal powder, thixotropic agent, leveling agent, and coupling agent.

TANG Z, CHEN Y

Electroconductive composition used as interconnection material to connect solar cells into photovoltaic module, comprises silicone resin, silicone crosslinker, electroconductive particles, solvent, adhesion promoter, catalyst, and inhibitor.

HENCKENS A, THEUNISSEN E, YANG J, ZHANG Y, CHEN Y