国家/地区 中国（7）
IPC部 B（7）
IPC大类 B32（7）
IPC小类 B32B（7）
IPC B32B009/00（4） C01B031/02（4） C01B031/04（3）
B32B007/02（2） B32B009/04（2） B32B027/06（2）
B32B027/08（2） B32B027/18（2） B32B027/20（2）
B32B027/30（2） B32B037/02（2） B32B037/10（2）
B32B037/12（2） B32B037/24（2） B82Y030/00（2）
发明人
公开年 2013（4） 2014（3）
申请年 2013（7）
专利权人

Electromagnetic wave-blocking material used for layered component, comprises composite resin and graphite flakes which are structure of graphene layers and have specified aspect ratio.

TAKAHASHI K, TSUMURA K, SAWA K

Thermal radiation film for e.g. electronic devices comprises heat-transfer layer formed by uniformly dispersed graphene microparticles and carbon nanotube.

KAGAWA S, SEIJI K

Thermosetting resin composition for pre-peg used for laminate and printed circuit board comprises thermosetting resin and inorganic filler in which inorganic filler is oxidized graphene or graphene coated treatment.

CHAI S, SU X

Structure useful to shield electromagnetic disorders for shielding electromagnetic radiation, comprises thin layer of graphene and flexible substrate, in which thin layer of graphene is applied on flexible substrate and is doped with dopant.

AVOURIS P, GARCIA A V, SUNG C, XIA F, YAN H

Transparent electrode for electronic material has graphene oxide layer formed on and/or under first electrode layer that is formed on glass substrate.

KIM W C, KIM J I, HUR K H, KANG H H, KIM W, KIM J, HUR K, CHEON K U, IL K J, HEON H G, WOON C K, JAE I K

Manufacturing laminated structure used in e.g. display, comprises bonding layer of graphene film on first substrate to second substrate with adhesive resin layer, removing first substrate and forming transparent layer on graphene film.

KIMURA N, SHIMIZU K, FUKUDA T

Manufacturing electrical conductor used in e.g. cables and printed circuit boards involves providing base substrate; providing foil; depositing graphene layer on foil to define layered structure; and depositing structure on base substrate.

MARTENS R I