国家/地区 中国（3）
IPC部 F（3）
IPC大类 F25（3）
IPC小类 F25B（3）
IPC F25B021/02（3）
发明人 TANG Y（3） YU H（3）
公开年 2015（3）
申请年 2015（3） 
专利权人 TANG Y（3） YU H（3）

Semiconductor heating plate, has power supply unit connected with metal conductor, N-type semiconductor and P-type semiconductor that are connected with graphene unit, and heat radiator formed with heat radiator graphene layer.

TANG Y, YU H

Open cooling device, has power supply unit connected with electrodes, and N-type semiconductor formed with graphene layer, where P-type semiconductor and N-type semiconductor are formed with uniform graphene unit.

TANG Y, YU H

Cooling device, has graphene layer fixed with P-type semiconductor, and heat conductor connected with heat radiating sheet, where P-type semiconductor is connected with N-type semiconductor that is fixed with graphene layer.

TANG Y, YU H