国家/地区 中国（6）
IPC部 B（6）
IPC大类 B32（6） C08（5） H05（2）
IPC小类 B32B（6）
IPC B32B027/04（6）
发明人 CHEN K（2） YU D（2）
公开年 2022（6）
申请年 2022（3）  2021（2） 
专利权人 ITEQ WUXI EL.（2）

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Epoxy resin composite material comprises component A and component B that are compounded with each other, where component A includes epoxy resin, preservatives, ultra-fine light calcium carbonate powder, graphene, and component B including carbon fiber mixed cloth woven from carbon fiber threads.

ZHANG W, FEI G, YUAN S

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

Preparing three-dimensional graphene functional composite laminated material useful e.g. in strain sensing, involves dipping laser-induced two-dimensional graphene material into resin material liquid, and hot press molding, where resin material liquid comprises thermosetting resin and curing agent.

WANG G, GAO Y, LUO S

Graphene/SiCnw composite film modified carbon fiber composite material comprises composite preform impregnated with liquid resin and cured to obtain composite material.

ZHOU L, WANG B, ZHANG Y, WANG F