国家/地区 中国（7）
IPC部 B（7）
IPC大类 B32（7） C09（7）
IPC小类 B32B（7）
IPC C09K005/14（7）
发明人 LIU Y（2）
公开年 2022（7）
申请年 2022（6） 
专利权人

Preparing high thermal conductivity film material, comprises e.g. mixing aniline solution and sulfuric acid solution with carboxylated graphene, placing polyaniline/graphene film in tube furnace, performing high-temperature treatment, heat curing, covering and peeling off ITO glass substrate.

ZHANG Z, YAN J, WANG B, LIU Y, DI W, BU X

Carbon fiber thermal conduction composite material useful for thermal interface materials field, comprises e.g. carbon fiber, thermal conducting powder e.g. alumina, silicone oil, inhibitor, catalyst, aluminum powder, zinc oxide, coupling agent, phase change material e.g. paraffin and antioxidant.

FANG X, YANG S, SUN A, CAO Y

Preparing L-xylose by heterogeneous method comprises dissolving L-arabinose, ammonium molybdate, acetic acid in water, neutralizing using calcium carbonate, separating by ion exchange column, crystallizing by cooling and filtering, and drying crystal by segmented crystal suspension drying method.

JIANG X, HUANG Q

Preparing a graphite sheet carbon fiber heat-conducting interface material elastomer, comprises e.g. preparing two organosilicone carrier sheets and stretching, casting and coating the surface of organosilicone composite heat-conducting material glue solution containing carbon fiber.

SHEN J, FENG R

Preparing high thermal conductivity thick film of large-scale graphene interface involves adding natural flake graphite in the reaction unit that vitriol oil is housed, stirring, mixing uniformly, and adding oxidizing agent and oxidizing agent.

PANG K, LIU Y, XU Z

Heat conducting heat storage film comprises composite glue layer provided on at least part of surface of one side of first support layer, and second support layer whose one side is connected with heat storage layer and sealed with edge of first support layer.

WANG Y, ZHAO Y, XU J, CHEN T

Wireless charging receiving end wafer module structure comprises two adjacent nano-crystal layers bonded by heat-conducting double-sided adhesive tape, nano wafer layers whose outer surface is located in uppermost layer and lowermost layer adhered with polyethylene terephthalate film.

YANG J, HU S, GU B