国家/地区 中国（8）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08K（8）
IPC C08K003/08（8）
发明人 XIANG J（2）
公开年 2015（6） 2014（2）
申请年 2014（8）
专利权人 XIANG J（2）

Oriented graphene/polymer composite system used for heat guide material, comprises oriented network component graphene, aligned network component and composite substrate component.

CHEN M, GUO Y, LI Q, LI W, LIAO S, LIU C, LIU L, QIU S, ZHU C

Decorative material used for artificial quartz stone, comprises PVC, plasticizer, lubricant, leveling agent, calcium zinc stabilizer, antioxidant, calcium powder, and graphene.

HE B

Steel mesh structured composite pipe contains high-density polyethylene, low-density polyethylene, linear low-density polyethylene, ethyl vinyl acetate, graphene, carbon nanotubes, polyimide fibers, and drawing grade polypropylene.

XIANG J, WU Y

Thermally-conductive silicone rubber contains aluminum powder, graphene, ceramic powder, lithium carbonate, metavanadate, ascorbic acid, chlorinated paraffin, rare-earth additive and methyl vinyl phenyl silicone rubber.

REN Z

Ink composition comprises sodium alginate, propylene glycol methyl ether, metal powder, three-dimensional graphene, mercaptan, ammonium polyphosphate, urea, 2-heptadecylimidazole and citric acid.

JIN Z, ZHANG F, QUAN C

Antifouling high-density polyethylene double-wall corrugated pipe includes high-density polyethylene, low-density polyethylene, graphene oxide, montmorillonite, titanium dioxide, catechin, silica, zirconium sulfate and composite lubricant.

XIANG J

High impedance high attenuating backing material preparation by preparing three-dimensional graphene foam framework using ethanol as carbon source, molding, pouring mixture of tungsten powder and epoxy resin, and performing film compacting.

HU P, YANG H, ZHANG R, YANG B, CAO W, GAO F, LIU J, LU Y, QIU Y

Preparation of conductive composite used as substitute for metallic conductive material, involves mixing e.g. carboxylated graphene oxide-doped polyaniline, methylpyrrolidone, carbon black and defoaming agent, casting and drying.

XU X, GUO D, HUANG C, LI J, LING M