国家/地区 中国（28）
IPC部 F（28）
IPC大类 F28（28） H05（19） F24（8）
H01（8） G06（4） H02（4）
B32（3） C23（3） C09（2）
IPC小类 F28D（28）
IPC H05K007/20（11） F28D020/02（7） F28F021/02（7）
F28D015/02（6） F28D015/04（5） H05B003/14（5）
G06F001/20（4） H01L023/427（4） F24H007/02（3）
F24H009/18（3） F24H009/20（3） F28D009/00（3）
F28D020/00（3） H05B003/02（3） B32B007/12（2）
发明人 YANG C（4） CHEN M（3） CHEN Y（3）
ZHU D（3） HONG Y（2） HORNG A（2）
ZHENG Z（2） ZHONG M（2）
公开年 2021（13） 2022（7） 2023（4） 2020（2）
申请年 2020（13）  2022（6）  2021（5） 
专利权人 SHANGHAI ZON.（3） LAUREL ELECT.（2） SUNONWEALTH .（2）

Graphene coating PTC constant temperature heater, has lifting component comprising stepping motor, screw thread screw rod, lifting seat and bearing seat, where surface of water tank is provided with guide component.

YANG C, SHENG W

Device for recycling low temperature waste heat freezing liquid, has heat conducting glue layer that is surrounded on inner surface of graphene layer, and inner layer surrounded on surface of glue layer.

SUN S, PENG W

Super-large-capacity chemical heat storage material on missile-borne electronic device, comprises hydrated salt, expanded graphite and graphene film, and prepared by melt-blending hydrated salt and expanded graphite and stirring to obtain composite melt, and cooling down to room temperature.

LAN Y, LIU J, YU X, FANG X, ZHANG Z, LING Z

Boiling device with crack-shaped quantum graphene film as substrate, has boiling radiating system supported by supporting column, and condenser is connected with first side end of boiling cavity through liquid flow pipe.

TAO P, SHANG W, SONG C, DENG T, FU B, CHU B

Uniform temperature device, has base plate comprising first surface and second surface opposite to first surface, heat conducting piece arranged on first surface of substrate, and radiation layer arranged on second surface.

ZHONG M, ZHENG Z

Uniform temperature device i.e. stacked uniform temperature equalizing device, has set of heat conducting pieces arranged on first surface of base plate, and radiation layer arranged on second surface of plate.

ZHONG M, ZHENG Z

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Directional hydrophobic structure for electronic packaging drainage device, has directional hydrophobic spacer that is arranged on substrate, and micro-grooves that are discharged into packaging mold along tapered micro-pillars.

LI B, GUO Y, XIE B, WEN G, CHEN Y, OU Z, HOU M

Composition for porous graphene comprises graphene heating film, where one graphene of the heating film is provided with heat storage layer, and heating graphene and the storage layer are covered on the upper layer protection layer.

DUAN Z

Preparation method of nano liquid absorbing core for intelligent product or electronic product, involves taking metal core and in situ growing graphene with hydrophilic functional groups on surface of the metal core.

JIA Y, WU Q, MA Y