国家/地区 印度（3）
IPC部 C（3）
IPC大类 C09（3） C08（2）
IPC小类 C09D（3） C08K（2） C08L（2）
IPC C09D163/00（3）
发明人
公开年
申请年 2020（2） 
专利权人

Liquid formulation used to form film on both porous and non-porous substrates e.g. wood, plastics, glass, ceramics, paper, metal, and cemented surfaces, comprises nanostructures, stabilizer, film forming polymer and solvent.

AGRAWAL A K, JASSAL M, ARORA V

Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.

KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K

Coating composition for coated structure comprises binder system e.g. epoxy-based and/or silicate-based, zinc particles, microspheres, and conductive pigment e.g. graphite, carbon black, graphene, aluminum, black iron oxide, and/or mica.

CAMPS M B, PAULSEN A L, BARGALLO J P, VOSTRACKA T, VOSTRACKAI T, BARGALLO Y P