国家/地区 韩国（7）
IPC部 C（7）
IPC大类 C08（7） C09（6） B32（3）
F16（3） F28（3） F21（2）
H05（2）
IPC小类 C08K（7）
IPC C08K003/04（6） B32B027/18（2） C08J005/10（2）
C08K007/06（2） C08L101/00（2） C09D007/61（2）
C09D007/62（2） C09D201/00（2） C09K005/14（2）
F21V029/85（2） H05K007/20（2）
发明人 LI Z（2）
公开年 2021（4） 2022（3）
申请年 2020（7）
专利权人

LED heat dissipation lighting light surface treatment composition useful for street lamp case comprises heat dissipation unit made of aluminum which is formed in multiple body portion and radiates heat generated from lighting module.

WOO L, UK L D

Diffuser mechanism of non-welding structure useful in seawater discharge channel comprises pipe component closely supports sleeve on spool of hull, and diffusion component supporting wing pieces inside sleeve.

SEOK N

High thermal conductivity and low gas permeability fluororesin tube useful for heat exchanger comprises fluororesin, thermally conductive flat filler and filler in form of nano-sized thermally conductive fibers.

CHOI J H

Cooling structure used for cooling article, comprises infrared ray and UV ray absorption and emission layer comprising polymer matrix and conversion material comprising nanoparticles of core-shell structure including core formed of semiconductor material and shell, and visible light reflective layer.

OH S J, LEEHEON, JEON S, SONSUMIN

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z

Manufacture of heat-dissipating composite material used for electronic device, involves e.g. mixing inorganic binder and filler to prepare mixture, heat-treating obtained mixture, and mixing composite particles and polymer material.

CHOA Y H, RYU S H, LIM M S, CHO H B, SONG Y S, CHOA Y, LIMMINSUP, CHO H, SONG Y