国家/地区 韩国（5）
IPC部 B（5）
IPC大类 C09（5）
IPC小类 C09D（5）
IPC C09D163/00（5）
发明人
公开年
申请年
专利权人

Coated substrate used in e.g. vehicles, bus bars and metal wires, contains first coating layer comprising electrodepositable coating layer, and second coating layer comprising powder coating layer on at least portion of first coating layer.

VISSER S J, WOODWORTH B E, GONDERJONES H, SCHNEIDER J R, MOORE K L, FOLLET M L, MA L, MUNRO C H, POLLUM M M, FRENCH M S, CONDIE A G, HARRISON A E, SCHWENDEMAN I G, DEI D K, BANCROFT C N, APANIUS C, SYLVESTER K T, DEDOMENIC C J, PUODZIUKYNAITE E, HOLLY G, AMII H, NOEL B C, CHRISTOPHER A, POLLUM J M M, GONDERJONES H A

Composition used in protective coating of steel structure, comprises performance modifier and modified filler comprising heavy calcium carbonate, fine ceramics, beryllium oxide, boron nitride, chromium oxide, carbon fiber ash and graphene.

PARK D S

Insulating composition for manufacturing substrate such as printed circuit board comprises graphene oxide and insulating material comprising graphene oxide; and polar solvent having specific solvent polarity index.

JI S Y, SEO S H, HAM S J, KIM S H, SOO Y J, SHANG H S, SUK J H, SEUNG H K

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Resin composition for treating surface of steel sheet, comprises binder resin, graphene and solvent.

CHO J D, LEE J R, LEE J S, SHIM S E, LEE J, CHO J, SHIM S