国家/地区 台湾（6）
IPC部 C（6）
IPC大类 C09（6） H05（6） H01（4）
C01（3） B32（2） C08（2）
IPC小类 C09D（6）
IPC H05K009/00（6）
发明人
公开年 2022（3）
申请年 2021（3） 
专利权人

Electromagnetic interference shield comprises substrate, metal-based conductive additive, and binder incorporated with metal-based conductive additive and deposited as electromagnetic interference shielding coating on substrate.

ELKADY M F, LANE S, KANER R B, KAVANAUGH J

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Electromagnetic wave absorption structure comprises electromagnetic wave composite absorbing layer, where electromagnetic wave composite absorbing layer comprises conductive composite layer and insulating layer, and insulating layer is stacked and overlapped with conductive composite layer.

WU F

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Production of graphene involves applying physical force to liquid dispersion of dispersing agent containing polyaromatic hydrocarbon oxide, and carbon-based material comprising graphite, and forming graphite into nano graphene flakes.

SOHN K N, YOO K H, KWON W J, LEE K S, YANG S B, KIM I Y, LEE M J, LEE J Y, SOHN K, YOO K, KWON W, LEE K, YANG S, KIM I, LEE M, LEE J, LI M, LI J

Manufacture of electromagnetic-wave-absorption film for e.g. personal computer, involves coating organic-solvent dispersion liquid comprising graphene microparticles and binder resin on surface of plastic film, and drying coated film.

KAGAWA S, SEIJI K