国家/地区 世界知识产权组织（4）
IPC部 A（3）
IPC大类 A24（3）
IPC小类 A24B（3）
IPC A24B015/16（3） A24B015/42（3）
发明人 HUANG H（4）
公开年 2023（4）
申请年 2022（4）
专利权人 PHILIP MORRI.（3）

Forming dual damascene structure on semiconductor substrate, involves selectively depositing carbon layer on exposed metal surface.

PARBATANI A, VAN SCHRAVENDIJK B J, VARADARAJAN B N, NARKEVICIUTE I, SRINIVASAN E, SHARMA K, KNARR R, SCHMITZ S, RAMANAN V, NOGAMI T, NGUYEN S V, HUANG H, SHOBHA H K, LI J, PEETHELA C B, EDELSTEIN D C

Aerosol-forming substrate for aerosol-generating article, comprises carbon particles, aerosol former, fibers, and binder, where each of carbon particles contains graphite, expanded graphite, graphene, carbon nanotubes, charcoal and diamond.

FEDELI F, WAIRIMU E, HUANG H, AJITHKUMAR A, DUPASQUIER Y, VAN DEN BOOGART M A F

Aerosol forming substrate for use in heated aerosol-generating article, has co-laminated sheet comprising layer of aerosol forming material and layer of carbon-based thermally conductive material.

HUANG H, AJITHKUMAR A

Aerosol-generating article e.g. electrically heated aerosol generating device, for producing aerosol in e.g. inductive and resistive heating device, has substrate formed in form of segment, and heating element configured to heat substrate.

CAMPITELLI G, FEDELI F, HUANG H, FARINE M