国家/地区 中国（6） 美国（2）
IPC部 C（7）
IPC大类 C25（7） H01（7） C01（2）
C23（2）
IPC小类 C25D（7）
IPC C01B031/04（2） C23C014/34（2） C23C016/26（2）
C25D009/04（2） C25D015/00（2） H01B013/00（2）
H01L021/02（2）
发明人 WANG M（2）
公开年 2016（7）
申请年 2016（7）
专利权人 WANG M（2）

Method for synthesizing multi-layer graphene e.g. trilayer graphene, involves heat-treating catalytic metal layer on substrate while supplying methane gas, and synthesizing multi-layer graphene on heat-treated catalytic metal layer.

HAM M, SON M, HAM M H, SON M W, XIAN W, SUN M

Manufacture of electric wire and cable comprises preparing plating solution containing copper sulfate, sulfuric acid, chloride ion, surfactant and nano-graphene, setting copper sheet anode and copper cathode in plating solution, and heating.

WANG M

Preparation of excellent-electrochemical performance manganese cobalt sulfide/graphene composite material used for preparing large-area electrode material by using electrochemical deposition solution containing thiourea.

YU M, LI X, LIU J, MA Y, LI S

Preparing conductive wire core involves preparing plating solution by mixing copper sulfate, sulfuric acid, chloride ion, surfactant, nano-graphene and nano activated carbon and ultrasonically treating.

WANG M

Manufacturing method of graphene layer on substrate, involves exfoliating metalized graphene layer from first substrate and laminating metalized graphene layer to second substrate.

ZARETSKI A, LIPOMI D J

Lead storage battery grid alloy preparation method involves adding modified graphene powder to diffusion plating solution containing lead ions, and carrying out electroless deposition using inert conductive substrate and pure lead plate.

CHEN F, HE Y, KONG C, ZHANG F, GUO Z, BAI H, QIAN Y, YU C

Sealing structure for copper column convex point, has copper pillar formed on surface of reduced oxide graphene layer, and metal barrier layer formed on surface of copper pillar, and solder bump formed on surface of metal barrier layer.

LIN Z, TANG H