国家/地区 中国（12）
IPC部 C（9） B（4） H（3）
IPC大类 C08（5） C09（4） H01（3）
B29（2） C23（2）
IPC小类 C08K（5） C08L（5） B29C（2）
C09D（2） C09J（2） C23C（2）
H01M（2）
IPC C08K003/18（5） C08L063/00（3） C08L063/02（2）
C08L063/04（2） C08L079/04（2） C08L079/08（2）
H01M010/0525（2）
发明人 LV T（12）
公开年 2021（7） 2022（5）
申请年 2021（12）
专利权人 AEROSPACE SP.（4） AEROSPACE RE.（2）

Cathode comprises a cathode current collector, a cathode active material layer and a lithium replenishing layer.

HUANG X, LV T

Preparing graphene by relatively closed area solid-phase process, comprises successively or simultaneously depositing carbon source layer and catalytic metal layer on surface of clean substrate to obtain graphene preparation precursor, and heat annealing in oxygen-free or low-oxygen environment.

DUAN J, DENG L, LV T, WU H, ZHANG W, XIONG W

Wave-absorbing film comprises wave-absorbing adhesive film comprising reinforcing layer or adhesive film layer, wave-absorbing layer and backing, where wave-absorbing layer and backing are respectively arranged on outermost side of wave-absorbing film.

GONG Y, PANG C, LI Y, LV T, LI M

Wave absorbing glue film comprises wave absorbing layer one or two sides set with reinforcing layer outer side set with adhesive film layer outer side set with backing and absorbing layer film formed by mixing wave absorbing material and resin matrix.

ZHAO H, DU P, LI Y, LV T, LI M

Preparing graphene-reinforced red copper contact material useful for electric contact i.e. electric switch and instrument assembly, comprises mixing solid carbon source and catalyst, pre-coating on surface of red copper material, irradiating by high-power laser, and growing surface-covered graphene.

HE Y, DU X, GUO D, ZHANG F, TANG B, LV T, CAO Y, XU G

Preparing wave absorbing bismaleimide resin comprises mixing bismaleimide resin, epoxy resin and absorbent in internal mixer, refining, absorbing bismaleimide resin, introducing curing agent and curing at different temperature stage.

LI M, LI Y, LIU P, GONG Y, LV T

Preparation method of wave-absorbing epoxy resin of wave-absorbing epoxy resin composite material, involves banburying and coarse mixing epoxy resin and absorbent, refining, mixing, adding curing agent, triggering and curing wave-absorbing epoxy resin curing system at different temperature stages.

LV T, LI Y, GONG Y, LI M, ZHAO H

Preparing absorbing cyanate ester resin comprises e.g. adding cyanate ester resin, epoxy resin and absorbent into internal mixer to carry out banburying and coarse mixing, refining, mixing, and triggering curing of the absorbing cyanate resin curing system at different temperature stages.

LIU J, ZHU W, GONG Y, ZHAO H, LV T

Preparing co-cured wave-absorbing composite material comprises paving one layer of first prepreg on forming mold, pre-compacting, paving one layer of second prepreg, covering one layer of absorbing adhesive film on the composite material substrate, covering one layer of third prepreg and curing.

GONG Y, YAN L, LI M, LV T, LI Y

Graphene infrared heating machine structure, has glue film that is formed between heating plate isolation protection layers, graphene infrared heating layer that is coated on control substrate on power supply circuit, and heating control substrate that is electrically connected with control portion.

LV T, LV L