国家/地区 韩国（5） 中国（4） 美国（3）
IPC部 C（7）
IPC大类 C01（7）
IPC小类 C01B（7）
IPC C01B032/21（7）
发明人 CHOI S（2） KWON H J（2） SONG J（2）
YUMINSOOK（2）
公开年 2021（3） 2022（2） 2023（2）
申请年 2021（7）
专利权人 PURE MANN IN.（2）

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Heat dissipation graphite sheet useful in producing mobile phones and thin portable products comprise heat dissipation layer containing urethane resin, and expanded graphite particles applied to one surface of graphite layer.

KIMTAEHAN, KWON H J, CHOI S, SHIM Y, SONG J, YUMINSOOK

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Electromagnetic interference (EMI) shielding device has dielectric layer and layer of fillers that have volume overlapped with each other when carbon-based materials are self-aligned in presence of magnetic field.

LIU C, LI W C, CHEN X, KWOK C H, LI W, GUO Z

Manufacturing graphite composite material comprises e.g. agitating graphite-graphene, thermally drying base sheet coated with mixed raw material, rolling to obtain graphite composite and taking graphite composite material from base sheet.

DEOK C Y

Olefinic carbon film for covering central processing unit, comprises polyimide film, graphene layer, compounded on the two surfaces of the polyimide film, and is prepared by carbonizing the polyimide film graphitizing and rolling or laminating.

ZHOU Z, SHI L, ZHU Q

Preparing high-flexibility graphite material or graphene material radiating component, comprises plasma cleaning graphite, mixing components of activating agent, preparing activating catalyst, washing and drying raw product electroplated with copper layer.

PANG M, PANG M X, MACING F