国家/地区 美国（4）
IPC部 F（4） H（3） B（2）
IPC大类 F28（4）
IPC小类 F28F（3） B32B（2） F28D（2）
H01L（2） H05K（2）
IPC B32B003/26（2） B32B007/12（2） F28F021/02（2）
H01L023/367（2） H01L023/373（2） H05K007/20（2）
发明人
公开年 2022（4）
申请年 2021（4）
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Graphene and carbon nanotube based thermal management device, has heat sink base and heat sink fins comprising single element formed from graphene layers with nanotubes interposed between graphene layers.

GOERGEN J R, ACHKIR D B, CAP M O, DOGRUOZ M B

Apparatus for removing heat from integrated circuit devices, has thermal interface material that contacts anisotropic thermally conductive section of heat dissipation device and contacts integrated circuit device.

SWAN J, ELSHERBINI A, EID F