国家/地区 台湾（7）
IPC部 C（5） H（4）
IPC大类 C01（4） H01（3） H05（3）
IPC小类 C01B（4） H01L（3） H05K（3）
IPC H05K007/20（3） C01B032/182（2） C01B032/19（2）
C01B032/20（2） H01L023/36（2） H01L023/373（2）
发明人 HE M（7） HUANG H（6） HUANG C（4）
CHENG C（3） WEI S（3）
公开年 2022（7）
申请年 2021（7）
专利权人 CTRON ADVANCED MATERIAL CO LTD（7）

Heat dissipation structure for electronic device e.g. mobile phone, has heat dissipation module whose side protrudes from top surface of heat generating element, and does not contact with surface of carrier.

HE M, HUANG H, HUANG C

Heat dissipation structure for use in electronic device, has heat dissipation module placed on surface of carrier, and including covering heating element, where setting position of module corresponds to heating element.

HE M, HUANG H, HUANG C

Graphene generating device comprises reaction tank containing electrolyte, reaction unit disposed in reaction tank, where reaction unit includes first part, second part and porous holder, and second part is surrounded by periphery of first part.

WEI S, CHENG C, HUANG H, HE M

Graphene generating device comprises reaction tank containing electrolyte, graphite electrode and pair of facing electrodes, fixing member disposed in reaction tank, and power supply unit electrically connected with graphite and facing electrodes.

WEI S, CHENG C, HE M, HUANG H

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Heat dissipation structure for electronic device, has heat dissipation coating including filler and bonded unit, where filling unit is mixed in bonded unit and filling unit includes graphene, carbon nanotubes, boron nitride and/or silicon carbide.

HE M, HUANG H, HUANG C

Filter structure for filter device, has graphene microplates and activated carbon particles that are filled in gap.

HE M, WEI S, CHENG C