国家/地区 中国（7）
IPC部 C（7）
IPC大类 C09（7） H01（2）
IPC小类 C09J（7）
IPC C09J011/04（5） C09J011/08（3） C09J007/10（2）
C09J007/30（2） C09J011/06（2） C09J109/06（2）
C09J133/00（2） C09J175/04（2）
发明人 WANG C（7）
公开年 2023（4） 2022（3）
申请年 2022（7）
专利权人

Oily solvent used for preparing oily bonding material for preparing electrode slurry for electrode sheet.

XU R, WANG C

Preparing moisture-proof glassine release paper involves e.g. placing glassine base paper in processing vessel, adding corona liquid and moisture-proof modifier to processing vessel, corona treating, coating moisture-proof release agent on surface of glassine paper using coating machine, and drying.

SHI W, WANG C, FENG G

Dispersing nano-silica powder in N,N-dimethylformamide, adding toluene- 2,4 diisocyanate, amine functionalized graphene oxide, and polyol and diisocyanate, small molecule alcohol, composite material and antioxidant into reaction kettle stirring uniformly and cooling with cold water.

KAN B, LI W, WANG C

Flame retardant modified epoxy resin adhesive film useful in technical field of high molecular materials, aerospace, electronic device, traffic transportation, building material, and defense military industry, comprises e.g. phosphabicyclo-triazine derivative modified graphene and epoxy resin.

WANG S, WANG C

Back glue useful for ceramic tile in household decoration, comprises component comprising acrylic acid emulsion, aqueous polyurethane emulsion, thixotropic agent, defoamer, bactericide, and water.

WANG C, ZHANG L, HAN S, FANG X, DONG F, HE S

Anti-examination modified adhesive rubber comprises e.g. natural rubber, styrene-butadiene rubber, butadiene rubber, anti-aging agent, resorcinol, carbon black, anti-scorch agent, chlorinated polyethylene, zinc oxide, stearic acid, aromatic oil, insoluble sulfur, accelerator.

WANG D, WANG C

Mini light emitting device display module useful in electronic device, comprises light emitting device chip set on one surface of printed circuit board and second adhesive layer has uniform light effect and arranged to cover light emitting device chip and first adhesive layer.

DING C, WANG C, XIA J, XU X, ZHENG P, ZHOU C, LI X, YANG G