国家/地区 中国（5）
IPC部 H（4） B（2） G（2）
IPC大类 H05（3） H01（2）
IPC小类 H05K（3） H01L（2）
IPC H05K007/20（3）
发明人 XIAO Y（5） HE M（2）
公开年 2021（5）
申请年 2019（3）  2020（2） 
专利权人 CTRON ADVANCED MATERIAL CO LTD（5）

Composite filtering structure for filter element, has first filter film connected with second filter film that is provided with first and second graphene micro-sheets, where first filter film includes first surface and second surface.

XIAO Y

Bending-resistant radiating structure for electronic device, has non-woven layer fixedly connected with radiating film, and first non-woven radiating layer fixedly connected with second non-woven radiating layer and graphene material.

XIAO Y

Bending-resistant heat radiating structure for electronic device, has non-woven layer provided with multiple fibers that are provided with non-woven material, and graphene material is fixed in gaps of fibers to fill gaps of fibers.

XIAO Y

Heat conduction structure used in mobile device, has two heat conduction layers and metal microstructure that form stacked structure and stacked structure that is divided into two sections in direction along axis of heat conducting unit.

XIAO Y, HE M, SHIAU Y

Thin film flip chip package structure for display device, has adhesive piece set on thin film substrate, chip and radiating piece, where adhesive piece fills gap between chip and thin film substrate.

HE M, HUANG J, XIAO Y