国家/地区 韩国（8） 美国（6）
IPC部 H（8） B（2） C（2）
IPC大类 H01（8） B23（2）
IPC小类 H01L（5） H01M（3） B23K（2）
IPC H01M004/62（3） H01M010/052（3） B23K026/20（2）
H01L023/00（2）
发明人 KIM J Y（3） KIM K（3） KIM K M（3）
LEE Y（3） LEE Y K（3） CHANG K S（2）
CHOI G（2） CHOI K（2） EOM Y S（2）
JANG K S（2） JOO J（2） JOO J H（2）
KANG S（2） KANG S H（2） LEE C（2）
公开年 2022（8）
申请年 2021（6） 
专利权人 ELECTRONICS TELECOM RES INST（8）

Laser contacting process used for bonding semiconductor elements, involves controlling amount of laser light absorbed by laser control structure, and bonding contacting sections and contacting object.

JANG K S, EOM Y S, CHOI G, CHOI K, JOO J, MOON S, LEE C, CHANG K S, MUN C K, JOO J H, MOON S H, LEE C M, WEN S, ZHU Z, CUI G, YAN L, CHANG K

Gallium nitride microstructure, has graphene layer that is provided on substrate, and gallium-nitride layer that is formed on graphene layer.

PARK J H

Biosensor for analyzing infectious pathogens, has optical structure provided on substrate, and cover having bridge shape that is in contact with top surface of substrate at both sides of optical structure and having channel.

KIM J T

Display device e.g. LCD, has light emitting layer that is provided between pixel electrodes and common electrode, and thin film encapsulation layer which is provided on common electrode and includes inorganic layer and two-dimensional crystalline material layer.

SHIN J, CHANMO K, BYUN C, CHO N S, CHO H, CHOI S K, KWON B, MOON J, IK L J

Cellulose derivative composition for preparing a composition for a secondary battery electrode.

OH J, KIM J Y, KIM D, KIM K M, SONG J, BYUN S, LEE Y M, SHIN D O, LEE Y, LEE Y K, BYUNSEUNGWOO, KIM K, HWAN K D, OH J M

Composite electrode for all-solid-state secondary battery comprises two active materials which include different materials from each other and have predetermined volume change rate according to volume expansion/contraction.

OH J, KIM K M, LEE M J, SHIN D O, KANG S H, LEE Y, KIM J Y, LEE Y K, KANG S, KIM K, OH J M

Manufacturing secondary battery separator in portable electronic communication device, involves dissolving polymer binder in water, dispersing particles in aqueous binder solution, preparing separator substrate, and applying slurry on upper and lower surfaces of substrate.

KIM K M, PARK Y S, KANG S H, LEE Y, KIM J Y, LEE Y K, KANG S, SAM P, KIM K

Fabricating semiconductor package by preparing a lower element including lower substrate, lower electrode, under bump metallurgy layer and reducing agent layer, providing upper element, providing pressing material, and providing laser beam.

JANG K S, LEE C, MOON S, CHOI G, JOO J, EOM Y S, CHOI K, JOO J H, MUN C K, MOON S H, LEE C M, CHANG K S