国家/地区 世界知识产权组织（4）
IPC部 B（3） G（3） C（2）
H（2）
IPC大类 B29（2） C23（2） G06（2）
H05（2）
IPC小类 B29C（2） C23C（2） G06F（2）
H05K（2）
IPC
发明人 WU K（3） CHANG C H（2）
公开年 2022（3）
申请年 2020（4）
专利权人 HEWLETTPACKARD DEV CO LP（4）

Anti-corrosive metal housing for electronic device has metal substrate, passivation layer including oxyanion e.g. molybdate, vanadate, and/or manganese salt, and sealing layer including e.g. sodium silicate, zinc powder, and/or clay powder.

LI Y, CHUANG Y C, WU K

Thermal management device for electronic device, has bracket that is provided with clamping portion that holds heat pipe by side exterior surfaces of heat pipe, and that does not extend past first exterior surface of pipe.

HUANG H, WU K, CHANG C H

Three-dimensional build material composition for three-dimensional printing, comprises polyamide particles and biodegradable polyester filler particles without any additional filler particles.

DISCEKICI E H, FLEISCHMANN C, WOODRUFF S R, YEMANE A

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y