国家/地区 世界知识产权组织（5）
IPC部 B（4） C（3） G（3）
IPC大类 B82（3） B01（2） C08（2）
C09（2） G01（2） G06（2）
IPC小类 B82Y（3） C09D（2） G01N（2）
G06F（2）
IPC B82Y030/00（3） C09D005/00（2） C09D175/04（2）
发明人 WU K（2）
公开年 2022（3）
申请年 2021（5）
专利权人 HEWLETTPACKARD DEV CO LP（5）

Epoxy molding compound used in fluid ejection device for encapsulating fluidic dies, comprises hardener, inorganic based filler, catalyst to accelerate curing of epoxy molding compound, and conductive additive.

SONG B, ZHANG Z

Electrowetting surface used in digital microfluidic device, comprises electrodes comprising layer of conductive material deposited over substrate, and nanoceramic coating comprising ceramic nanoparticles bound together by polymeric binder.

CUMBIE M W, CHEN C, SHKOLNIKOV V

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Single point sensing system for identifying and analyzing fluid composition, has single-point sensor array comprising single point optical reader, where single point sensor array is arranged on single point substrate.

LEI Y, DAPUZZO F

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K