国家/地区 中国（4）
IPC部 H（3）
IPC大类 H01（3）
IPC小类 H01L（3）
IPC H01L023/373（3） H01L021/48（2） H01L023/367（2）
发明人 CAO L（4）
公开年
申请年
专利权人 NAT CENT ADVANCED PACKAGING CO LTD（4）

Graphene substrate useful for semiconductor chip, has graphene layer which is folded, and metal layer which covers surface of graphene layer.

CAO L, CHEN C, MA R

Preparing organic substrate composite material comprises e.g. preparing semi-curing structure, pre-treating fiber filler, implanting into semi-curing structure, preparing filler solution and stable film structure, freezing and drying.

ZHANG J, CAO L, WANG Q

Graphene thermal interface layer based heat radiating structure, has graphene layers formed with laminated structure, and cylindrical helical coil whose top and bottom surfaces are spirally rolled between graphene layers and adhesive layers.

CAO L, SUN P

Flexible substrate based three-dimensional packaging heat radiation structure, has graphene radiating fin fixed to contact surface of chip package body, and graphite heat abstractor provided with metal carrier chip.

CAO L, GUO X, HOU F, WAN L, SU M, WANG Q, ZHOU Y