国家/地区 中国（12）
IPC部 C（10） A（2） B（2）
IPC大类 C09（5） C08（4） A61（2）
B29（2）
IPC小类 C08K（4） C08L（4） C09D（3）
A61K（2） A61P（2） C09J（2）
IPC C08K003/04（4） C08K003/22（3） C08K005/12（3）
C08K013/02（3） C09D007/12（3） A61K031/155（2）
A61K033/44（2） A61P031/04（2） C08K003/06（2）
C08K005/098（2） C08L061/06（2） C08L071/02（2）
C09J011/04（2）
发明人 CHEN S（12）
公开年 2017（12）
申请年 2016（12） 
专利权人 NANJING RUNYI ELECTRONICS TECHNOLOGY CO（12）

Food preservative comprises polyethylene resin, graphene, titanium dioxide, polybutylene succinate, silicon carbide, magnesium oxide, stone powder, sodium diethyldithiocarbamate and sodium stearate.

CHEN S

Modified polyvinyl alcohol aqueous coating comprises preset amount of polyvinyl alcohol, graphene, defoamer, light calcium carbonate, talc powder, lithopone, and titanium dioxide.

CHEN S

Adhesive comprises specified amounts of polyurethane, chloroprene rubber, polyacrylate, graphene, triallyl isocyanurate, ethylenediamine, butanol, toluene, potassium stearate, polyvinylpyrrolidone and N-phenyl-beta-naphthylamine.

CHEN S

Antibacterial agent containing nano-scale graphene comprises nano graphene, chlorhexidine iodine, polyethylene glycol, dimethylcarbinol, diacetyl tartaric acid monoglyceride, distilled monoglyceride, glutaraldehyde and glycol.

CHEN S

Modified polystyrene foam thermal insulation material comprises polycarbonate particles, polystyrene foam particles, dioctyl phthalate, copper naphthenate, expanded perlite, limestone, graphene and gelatin.

CHEN S

Non-irritating fungicide comprises graphene, peroxyacetic acid, potassium permanganate, disodium EDTA, glutaraldehyde, chlorohexamethylene biguanide, and absolute ethanol.

CHEN S

Graphene-based high temperature resistant coating comprises preset amount of silicone resin, graphene, filler, industrial flavor, filler, and dispersant.

CHEN S

Graphene modified heat insulation material comprises polycarbonate particles, phenolic resin, phthalic acid diester, copper naphthenate, expanded perlite, limestone, graphene, and gelatin.

CHEN S

Graphene/polymer composite material sealing ring comprises graphene, ethylene oxide/propylene oxide block polyether, zinc oxide, dicyclohexyl phthalate, 2,2,4-trimethyl-1,2-dihydroquinoline polymer, phenolic resin, and sulfur.

CHEN S

Damping ring based on graphene/polymer composite material comprises polymer as substrate and graphene as filler, where polymer includes chloroprene rubber, ethylene oxide/propylene oxide block polyether and active agent zinc oxide.

CHEN S