国家/地区 美国（7） 世界知识产权组织（2）
IPC部 F（7）
IPC大类 F28（7）
IPC小类 F28F（7） H05K（3） B82B（2）
C08J（2） C09K（2） C22C（2）
C23C（2） C25D（2）
IPC F28F021/02（7）
发明人 LIN Y（7）
公开年 2019（2） 2021（2）
申请年 2018（3）  2019（2） 
专利权人 NANOTEK INST.（7）

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B

Graphene based highly elastic heat spreader film for electronic device, comprises multiple graphene sheets bind by binder material or dispersed in matrix material, and multiple graphene sheets substantially align to parallel to one another.

LIN Y, JANG B Z

Multilayer graphitic laminate used for electronic device, comprises at least two carbon-based layers containing graphene layer, and conductive adhesive layer comprising graphene sheets or expanded graphite flakes, and adhesive resin.

LIN Y, WANG Y, JANG B Z

Metal matrix nanocomposite used as e.g. load-bearing element, comprises metal or metal alloy containing gold and silver as matrix material, and multiple graphene sheet chosen from pristine graphene material or non-pristine graphene material.

ZHAMU A, LIN Y, JANG B Z

Producing metal matrix nanocomposite by preparing graphene dispersion, bringing the graphene dispersion in physical contact with solid substrate surface, and depositing layer of metal or metal alloy onto surfaces of aligned graphene sheets.

ZHAMU A, LIN Y, JANG B Z

Thermally conductive composite material used in electronic device e.g. CPU, comprises unitary graphene matrix material which is single crystal or polycrystalline, and contains chemically bonded graphene molecules or merged graphene planes.

ZHAMU A, XIONG W, JANG B Z, LIN Y

Integrated heat sink used in e.g. electronic device, has heat sink formed of nano graphene platelet-reinforced composite having discrete nano graphene platelets or sheets (NGPs) as reinforcement phase dispersed in matrix material.

LIN Y, ZHAMU A, JANG B Z