国家/地区 中国（6）
IPC部 C（4） B（3） H（3）
IPC大类 H05（3） B22（2） B33（2）
C09（2） C22（2）
IPC小类 H05B（3） B22F（2） B33Y（2）
C09D（2） C22C（2）
IPC B22F010/28（2） B33Y010/00（2） B33Y070/10（2）
C09D011/03（2） C09D011/102（2） C09D011/106（2）
C09D011/52（2） H05B003/14（2）
发明人 OU B（6）
公开年 2021（4） 2022（2）
申请年 2021（6）
专利权人 GUANGDONG GA.（3） JIANGSU PROV.（3） QINGYUAN JIA.（3） GUANGXI GANI.（2）

Method for preparing graphene composite 18Ni-300 anti-friction metal material based on selective laser melting (SLM) technology, involves subjecting anti-friction metal material formed to aging treatment to obtain finished graphene composite anti-friction metal material.

WANG R, LIU W, ZHAO W, LU Y, WANG Q, OU B

Heating device based on graphene heat conducting plate, has heating shell provided with feeding port, heating component provided with inner part of heating shell, and graphene heat conducting plate for heating bentonite mixed material, which is provided on stirring mechanism.

LU Y, ZHAO W, CHENG X, WANG Q, XIONG L, OU B

Preparing heating ceramic tile with stable electrical resistance, comprises pressing and molding tile blank on grooved mold, printing conductive resistance slurry in extrusion groove, curing, and applying insulating layer on surface of ceramic substrate printed with conductive resistance slurry.

LI Z, LIANG G, DENG B, ZHU L, OU B, SU W

Preparation of graphene composite wear-reducing metal material using selective laser melting (SLM) technology, for use in additive manufacturing application, involves selecting alloy powder, drying, grinding, sieving, mixing with graphene powder, spreading, melting, stacking and forming.

LIU W, WANG R, YU H, LU Y, OU B

Self-limiting temperature conductive ink comprises carbon-based conductive filling material, self-limiting temperature material, resin bonding material, additive and solvent.

LI Z, DENG B, YANG J, SU W, ZHU L, OU B

Conductive ink with temperature-limiting characteristic comprises carbon-based conductive filling material, conductive auxiliary materials, temperature limiting material, resin bonding material, additive and solvent.

ZHU L, SU W, DENG B, LI Z, OU B