国家/地区 韩国（6） 美国（3）
IPC部 C（5） H（5） B（2）
IPC大类 C08（3） H05（3） B82（2）
C01（2） H01（2）
IPC小类 C08K（3） H05K（3） B82B（2）
B82Y（2） C01B（2） H01B（2）
IPC C08K003/04（3） B82B001/00（2） C08K003/08（2）
H05K009/00（2）
发明人 RYU S H（6）
公开年 2013（2） 2022（2）
申请年 2021（2） 
专利权人 CHEORWON PLA.（2） KOREA MATERI.（2）

Composite material useful for electromagnetic shielding in e.g. mobile phone and computer, comprises conductive filler, which is partially attached to the particle surface.

LEE S B, PARK B J, RYU S H, KWON S J, CHOI J, HAN Y K

Composite material for shielding electromagnetic wave, comprises polymer material particles dispersed in polymer material matrix, and electromagnetic wave shielding filler provided in matrix and dispersed in region between polymer particles.

PARK B J, KWON S J, RYU S H, KIM T, LEE S B, LEE J S, JUNG B M, HAN Y K

Manufacture of heat-dissipating composite material used for electronic device, involves e.g. mixing inorganic binder and filler to prepare mixture, heat-treating obtained mixture, and mixing composite particles and polymer material.

CHOA Y H, RYU S H, LIM M S, CHO H B, SONG Y S, CHOA Y, LIMMINSUP, CHO H, SONG Y

Conductor, has nano pattern arranged on substrate, and graphene layer arranged over nano pattern that comprises set of linear structures extending in same direction and spaced apart from each other of set of linear structures.

JEONG S, KIM D, KIM H, KO W, KU J, RYU S, JEONG S J, KIM D G, KIM H W, KO W H, KU J Y, RYU S H

Graphene-nanoparticle composite used for laminate for electrochemical device, comprises crystallized nanoparticles including nickel, silicon, titanium, chromium, manganese, iron, cobalt, silver and/or magnesium, on surface of graphene.

KIM S, CHOI S Y, SHIN M S, LEE K H, SON B G, RYU S H

Graphene-nanoparticles composite used for electrochemical device, comprises nanoparticles of nickel, silicon, titanium, chromium, manganese, iron, cobalt, copper, tin, indium, platinum, gold or silver crystallized on graphene surface.

KIM S, CHOI S Y, SHIN M S, LEE K H, SON B G, RYU S H, SON B, SHIN M, RYU S, CHOI S, LEE K