国家/地区 日本（4） 世界知识产权组织（4）
IPC部 C（4） H（4）
IPC大类 C01（4） C23（4） H01（4）
H05（2）
IPC小类 C01B（4） C23C（4） H01L（4）
H05H（2）
IPC C01B032/186（4） C23C016/26（4） H01L021/205（4）
H05H001/46（2）
发明人 WADA M（4）
公开年 2022（4）
申请年 2022（3） 
专利权人 TOKYO ELECTR.（4）

Substrate processing includes taking substrate into processing vessel, removing oxygen-containing layer on substrate using plasma of gas mixture including hydrogen-containing gas, and forming nucleation layer and graphene film on substrate using plasma of gas mixture including carbon-containing gas.

IFUKU R, MATSUMOTO T, WADA M, KABUKI N

Processing substrate by loading substrate into processing container, forming carbon film on substrate with plasma of mixed gas containing carbon-containing gas while inside of processing container is maintained at pressure, and changing inside of processing container.

WADA M, IFUKU R, MATSUMOTO T, YAMADA H, TAKASHI M

Film formation method involves forming metal film on silicon-containing film of substrate, forming a graphene film on metal film, where metal film is silicided by heating metal film, and continuously performing film forming process.

UEDA H, WADA M, ZHEN

Substrate processing method for processing substrate, involves performing first plasma processing while holding carried-in substrate in first position, and performing second plasma processing in state where substrate support pin is lowered and substrate is held at second position.

WADA M, KABUKI N, IFUKU R, MATSUMOTO T