国家/地区 台湾（8）
IPC部 H（6）
IPC大类 H01（4） H05（3）
IPC小类 H01L（3） H05K（3）
IPC H05K009/00（3）
发明人 WU H（8）
公开年 2015（3） 2023（2）
申请年 2013（3）  2023（2） 
专利权人 WENDE IND CO.（2）

Highly thermally conductive composite structure for use in electromagnetic shielding electronic devices, comprises metal base having joint surface on one side of metal base, and high thermal conductivity composite layer.

ZHIHONG G, BOXIANG Z, WU H

High thermal conductivity electromagnetic interference shielding cover for use on electromagnetic shielding electronic devices, has composite layer formed on casing by coating coated surface of body, where material of layer includes nanotubes.

ZHIHONG G, BOXIANG Z, WU H

Electrode material for electrode used for lithium ion battery comprises electrode active powder and metal thin film that partially or completely wraps the surface of electrode active powder and comprises silver, gold, platinum, palladium, aluminum, magnesium, zinc, tin, or alloy.

LAI Y, CHIOU K, KUO S, PAN J, WU H, HO S, LIN Y, QIU G, HE S

Electromagnetic interference shielding membrane, comprises insulating layer having first surface and second surface and conductive layer, where insulating layer comprises first resin and graphene, which is distributed in first resin.

WU X, YU J, LAI Z, CAI M, WU H, YU C, LAI C, TSAI M

High-performance photocatalyst and manufacturing method thereof comprising titanium dioxide and graphene.

NIEN Y, WU H

Graphene magnetic chitosan polymer as a nano probe of detecting pathogenic bacterium.

WU H, ABDELHAMID H N, WU H F

Manufacture of oxide semiconductor composition used in manufacture of oxide thin-film transistor, involves mixing graphene, metal oxide precursor, and solvent, and preparing metal oxide solution, in which graphene remains dispersed.

LIANG J J, LIAN J T, WU H Y, FU H M, RYO K, HSIEH C, LIAN J, WU H, FU H, LIANG J, HSIEH C S

Making semiconductor device used in e.g. cell phone, by forming graphene-based conductive layer over surface of conductive feature within opening in insulating material, and forming carbon-based adhesive layer over sidewalls of opening.

YANG S, LEE M H, LEE H, WU H, LI M, LI X, WU X, LEE M, YANG S Y, LEE H H, WU H C