国家/地区 中国（5）
IPC部 H（4）
IPC大类 H01（3） H05（3）
IPC小类 H05K（3） H01L（2）
IPC H05K001/18（3） H05K003/00（3） H05K003/46（3）
H01L023/492（2） H01L023/538（2） H05K001/02（2）
H05K001/11（2）
发明人 ZHENG X（5）
公开年 2021（4）
申请年 2020（3） 
专利权人

Method for manufacturing component carrier e.g. printed circuit board, involves creating blind hole in stack towards embedded component, and extending blind hole by etching to expose surface portion of embedded component.

TUOMINEN M, TAY S K, ZHENG X

Manufacturing component carrier comprises providing laminated stack having electrically conductive layer structure and/or electrically insulating layer structure, at least partially covering component with transition layer and assembling component with stack , Manufacturing component carrier comprises providing laminated stack having electrically conductive layer structure and/or electrically insulating layer structure, at least partially covering component with transition layer and assembling component with stack.

TUOMINEN M, TAY S K, LIU K, BAFTIRI A, GUO H, ZHENG X, LIU Q, GUO Z

Carrier for e.g. electronic components comprises stacked electrically insulating layer structures, and through hole with narrower inner portion compared to exterior portions and filled with electrically conductive filler.

TUOMINEN M, TAY S K, SUN S, ZHANG R, ZHENG X, SUN L, ZHANG Z

Cosmetic composition, quasi-drug composition or pharmaceutical composition used for providing e.g. skin regeneration, anti-wrinkle and moisturizing or antioxidant effects and preventing skin aging, comprises graphene quantum dots.

JEONG S G, HONG B H, KYUNG S Y, CHOI Y S, KIM J H, YOON S K, YEO H J, KANG S H, PARK M S, JUNG S, CHOI Y, JUHEE K, YUN S K, YEO H, PIAO M, JIANG C, LV X, YIN X, KIM J, QING R, HONG B, ZHENG X

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X