国家/地区 中国（5）
IPC部 B（5）
IPC大类 B23（5）
IPC小类 B23P（5） F28F（3） F28D（2）
G06F（2） H01L（2） H05K（2）
IPC B23P015/26（5）
发明人
公开年 2022（2）
申请年 2020（2） 
专利权人

Aluminium graphene uniform temperature plate for flat computer internal heat dissipation, has graphene layer arranged between aluminum-based upper plate and aluminum-based lower plate, and cross-linking holes provided with aluminum-based connecting particles.

WANG G, XU X

Integral thin-wall fin tubular hydraulic oil heat exchanger for transferring heat of hot fluid to cold fluid, has heat conducting layer whose top is provided with corrosion resistant layer that is connected with flexible layer by adhesive bonding.

GUO X, YE Z, SHI W, ZHOU W, LIAO W, CHEN G

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Graphene heat pipe has tube casing whose left end is provided with evaporation end cover and whose right end is provided with heat dissipation cover whose middle portion is provided with filling port.

CHEN W, WU X, DU H

Thermal interface material (TIM) pad for dissipating heat from component in electronic device such as data storage device, has TIM layers, and graphene layer which is interposed between TIM layers.

MATAYA R A, SALESSI N M, SALEESI N M