国家/地区 中国（4）
IPC部 C（4）
IPC大类 C01（4）
IPC小类 C01B（4）
IPC C01B032/19（4）
发明人 WANG L（4）
公开年 2017（2）
申请年 2016（2） 
专利权人 CHENGDU NEW .（2）

Graphene heat dissipation coating used for radiator, comprises graphene-thermal conductive particle heterojunction material, where thermal conductive particle comprises aluminum nitride, gallium nitride, aluminum oxide and silicon oxide.

WANG L, DENG M, YUAN K, ZHANG Q, ZHANG T, FAN Y

Preparation of graphene for glass heat-conducting film, involves mixing graphite powder and surfactant, entering graphite powder into low pressure section of reactor, releasing high pressure gas and separating graphene.

CHEN Q, ZENG J, WANG L

Hot-melt release agent for screw cutting peeling graphene, contains ethylene-vinyl acetate copolymer, carboxylic acid graft-modified polypropylene wax, chlorinated paraffin, plasticizer, silicate, ammonium polyphosphate and antioxidant.

CHEN Q, ZENG J, WANG L

Preparation of graphene-based chip cooling material by reacting substrate, heating, plasma treating, depositing graphene, forming, cooling and transferring.

LIU J, XIE X, WANG L, ZHANG Y, WANG H