国家/地区 日本（4） 世界知识产权组织（4） 中国（3） 欧洲专利局（EPO）（2） 美国（2）
IPC部 C（5）
IPC大类 C04（5） B32（3） C01（3）
H01（3） B23（2） H05（2）
IPC小类 C04B（5）
IPC C04B037/02（5）
发明人 NOBUYUKI T（2） TERASAKI N（2）
公开年 2021（4）
申请年 2020（2）  2021（2） 
专利权人 MITSUBISHI M.（4）

Composite heat-transfer material used as thermally-conductive material in electronic device, comprises carbonaceous component comprising carbonaceous material and metal component comprising metal comprising aluminum alloy or magnesium alloy bonded to surface of carbonaceous component.

TAKASHI M, TAKUYA K, MAEKAWA T, KUBO T

Copper/graphene junction for e.g. engine compartment, comprises structure in which copper component and graphene-containing carbonaceous component are joined, active metal carbide layer, and magnesium solid solution layer in which magnesium is solid-solved in matrix phase of copper.

NOBUYUKI T, TERASAKI N

Graphene bonded body having structure comprises graphene-containing carbonaceous member containing graphene aggregate and member to be joined, junction interface, active metal compound layer formed on member, and tin-concentrated layer.

TOYO O, OHASHI T

Ceramic/copper/graphene assembly used as heat radiating member, has structure in which ceramic member, copper member and graphene-containing carbonaceous member are joined, active metal carbide layer, and magnesium solid solution layer.

NOBUYUKI T, TERASAKI N

Graphene-modified ceramic Polytetrafluoroethylene-based Printed Circuit Board copper clad laminate comprises ceramic-based prepreg, copper foil, ceramic-based prepreg, and layer of chemical vapor deposited graphene between copper foils.

ZHANG J, XU Y, ZHANG Y, WANG Q