国家/地区 世界知识产权组织（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08G（5） C08K（5） C08L（5）
C08J（3） C09D（2）
IPC C08G077/12（5）
发明人 FUJIMOTO T（3） MANDAL S（2）
公开年 2022（3） 2021（2）
申请年 2019（2）  2020（2） 
专利权人 MOMENTIVE PE.（3）

One-component thermal-gel composition used for heat dissipating material for dissipating heat from substrate, comprises crosslinkable organopolysiloxane, hydrolyzable organopolysiloxane, thermal conductivity enhancing agent, organopolysiloxane, adhesion promoter, antioxidant, and pigment.

DUTTA P, DASGUPTA D, MS A, FUJIMOTO T, CHISATO H, ANJITHA M, HOSHINO C

Addition curable silicone-imide composition for cured silicone-imide material for e.g., aerospace device, comprises alkenyl functional siloxane-imide copolymer, alkenyl functional organosiloxane, polyorganohydrogensiloxane and catalyst.

MILLER C, NARAYANAN R, ZAMPELLA J, RAJENDRA V, FUJIMOTO T, MANDAL S

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Additively manufacturing silicone elastomer article by applying additive manufacturing material on substrate and forming layer by addition-crosslinking electro-conductive silicone composition containing e.g., organopolysiloxane and catalyst.

YUE Y, JIA L

Producing silicone substrates or silicone composite substrates, comprises e.g. providing silane including alkoxysilane and/or hydroxysilane, preparing liquid oligosiloxane from silane by sol-gel reaction, and performing first crosslinking.

CLADE J, DOMANN G, LANG K