国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5） H05（2）
IPC小类 C08J（5）
IPC C08J005/24（5）
发明人 ZHANG W（5）
公开年 2023（3）
申请年 2022（2） 
专利权人 CHANGSHU SHE.（2） SHENGYI TECH.（2）

Graphene epoxy resin composite material comprises bisphenol A solid epoxy resin, bisphenol A liquid epoxy resin, toughening agent, phenolic novolac epoxy resin, graphene, curing agent, and accelerator.

ZHANG W, WANG Z, YAN S

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Resin composition useful in preparing low-flow adhesive prepreg comprises epoxy resin, epoxy curing agent, curing accelerator, carboxylated nitrile rubber, carbodiimide compound.

ZHANG W, CHEN C, HE J

Heat-resistant and high-strength composite material comprises grained woven fabric and fibrous insulating material made of oxide graphene polypropylene base machine.

CHEN Z, HUANG X, ZHANG W

Preparation of carbon fiber/graphite/epoxy resin prepreg used for preparing carbon fiber composite material involves preparing graphene/epoxy resin slurry, adding carbon fiber, soaking, friction rolling, drawing, winding, and drying.

ZHAO D, ZHANG W, LIN H, DONG H, WANG X