国家/地区 中国（5）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C08K（6） C08L（6） H05K（5）
C08J（2）
IPC C08K003/04（6）
发明人
公开年 2021（2）
申请年 2021（2） 
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Self-healing electromagnetic shielding material useful in electronic device, comprises polyacrylic acid, calcium chloride, water-soluble polymer, carbon material and water-soluble carbonate.

CHEN X, WANG Y, LAI D

Polybutylene terephthalate electromagnetic shielding composite material used in fields of wave absorption material, antistatic material, comprises polybutylene terephthalate base material masterbatch, graphene material, inorganic nano material, liquid crystal polymer fiber, flax fiber, carbon fiber.

LU T, CHEN K, ZHAO J

Preparation of building decorative wood-plastic board from broadband electromagnetic waves involves mixing material containing graphene-embedded tubular spinel type ferrite, and dried and ground wood powder particles, extruding, and molding.

CHEN Q, ZAN H, HE F, CHEN T, ZENG J

Conductive particle and power-regulating particle for e.g. electric heating film comprises resin, graphene, conductive carbon black, coupling agent, surfactant, dispersant, antioxidant and infrared enhancer.

XIA Y, HUANG X, HUANG S

Lightweight broadband electromagnetic shielding material comprises ethylene-vinyl acetate rubber, functional filler, reinforcing filler, processing aid and processing auxiliary, and graphene-ferroferric oxide-barium titanate.

ZHANG L, LIU P, WANG W, CHENG W