国家/地区 中国（3）
IPC部 B（4）
IPC大类 B32（4）
IPC小类 B32B（4）
IPC C08K003/26（4）
发明人
公开年 2023（4）
申请年 2021（2）  2022（2） 
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Production process of solarization-resistant wine packaging box comprises molding injection-molded plastic wine packaging box for polishing, coating ultraviolet resistance coating, drying, treating, and subjecting plastic wine packaging box for ultraviolet laser printing trademark pattern.

WANG H, MA X

Preparing high-temperature-resistant flame-retardant expanded polystyrene foam board comprises uniformly mixing and stirring to become main ingredient including melamine resin, and high temperature resistant filler, and pasting the two load-bearing boards on both sides of the composite board.

HE Y, RUAN X

Antistatic micro-foamed polyester for use to prepare packaging box or tray for electronic products such as LCDs, and computer connectors, comprises thermoplastic polyester, inorganic nucleating agent, antistatic agent and supercritical fluid.

FANG M, HU G, GAO J