国家/地区 中国（26） 美国（8） 日本（7） 世界知识产权组织（7） 欧洲专利局（EPO）（5） 韩国（4） 澳大利亚（2） 台湾（2）
IPC部 B（34）
IPC大类 B32（34）
IPC小类 B32B（34）
IPC C08K007/00（34）
发明人 WANG Y（3） KIGUCHI K（2） NAITO T（2）
SAWA K（2） SHI X（2） SHIMADA A（2）
SHIRATORI K（2） TAKAHASHI K（2） TSUCHIYA H（2）
TSUKADA Y（2） WANG L（2） WU Y（2）
YAJIMA A（2） ZHANG C（2）
公开年 2021（12） 2018（5） 2017（4） 2022（4） 2023（2）
申请年 2021（8）  2018（5）  2020（5）  2019（3）  2022（3）  2017（2） 
专利权人 SEKISUI CHEM.（3） NISSAN MOTOR.（2） SEKISUI CHEM.（2） TORAY IND IN.（2）

Composite material useful in stealth equipment, comprises e.g. structural layer, radar absorbing layer and infrared suppressing layer in sequence from inside to outside, where structural layer includes resin matrix wires and continuous fibers.

CHENG Y, WANG Y, LI Y, ZHANG X, HE W, HU L, YANG W, NIE X

Preparing high electromagnetic shielding nanofiber gas gel having gradient structure, comprises e.g. mixing isopropanol, deionized water and poly(vinyl alcohol-co-ethylene) nanofiber, adding graphene oxide, silver nanowires into poly(vinyl alcohol-co-ethylene) nanofiber suspension, and freeze-drying.

WANG W, YAN K, WEN X, YANG C, WANG D

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Thermally conductive film for heat dissipation structure, is formed by arranging binder and scale-like carbon materials formed by graphene layers, and making portion(s) of minor axis of binder and minor axes of spaces formed by carbon materials and binder smaller than minor axis of carbon materials.

NAITO T, TSUKADA Y, KENEKO T, YAJIMA A, SHIRATORI K

Heat conductive film used for head-up display, is configured by disposing scale-like carbon material formed by graphene layers such that adjacent scale-like carbon materials contact each other, and such that major axis of scale-like carbon material is oriented in surface direction of film.

KANEKO T, NAITO T, TSUKADA Y, YAJIMA A, SHIRATORI K

Honeycomb interlayer wave absorbing material for improving inclined incident wave absorbing performance, comprises a first skin, a wave absorbing aramid fibre honeycomb core, a wave absorbing putty and a second skin.

MENG L, HU D, WANG L, WANG Y, MING P, PENG X

High-barrier bromobutyl rubber with alternating layered structure, comprises carbon black modified bromobutyl rubber layer A and sheet filler modified bromobutyl rubber layer B.

ZHANG L, YANG S, GUO S, WU H, XIONG Y

Composition used for forming e.g. pipe, comprises resin and graphene material.

LADISLAUS P, ARMSTRONG N

Encapsulating resin composition useful for a surface acoustic wave device, comprises a resin matrix and a filler, where the resin matrix contains an epoxy resin and an epoxy resin curing agent.

LU B, CAO T, WU Y, WANG Y

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C