国家/地区 美国（5）
IPC部 C（5）
IPC大类 C08（5） C09（5） B01（2）
B32（2） C01（2） H01（2）
IPC小类 C08K（5）
IPC C08K007/06（5）
发明人
公开年 2021（5）
申请年 2020（3） 
专利权人

Dispersion useful for manufacturing additive for encapsulating electronic components, comprises portion of cross-linkable moiety, and oxidized discrete carbon nanotubes with bonded dispersing agent.

IVANOVA O, LOWDER S, SWOGGER K W, BOSNYAK C P

Integrating process of electrically conductive material into surface layer of electrically conductive polymer, involves including an electrically conductive material in a polymerisation mixture, and polymerising polymerisation mixture.

HIGHGATE D J, HOWLIN B J, TANG W

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

Infrared absorbing composition used in device, in layered structure as infrared emitter/absorber, to prepare surface to absorb infrared radiation and making coatings comprises layer of metal carbides and nitrides material.

HAN M, GOGOTSI Y

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E