国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08G（7）
IPC C08K007/26（7）
发明人 CHEN Y（2） LI J（2）
公开年 2022（5） 2023（2）
申请年 2022（7）
专利权人

Polyurethane resin comprises polyester polyol, toluene diisocyanate, 4,4'-diphenylmethane dibasic acid, chain extender, sealing agent, leveling agent, antioxidant, and wear-resistant additive comprising fumed silica, titanate coupling agent and graphene oxide.

DENG Z, ZHU H, WANG Y

Epoxy resin composite material with low viscosity and high mechanical strength for preparing high performance epoxy system with low viscosity and high mechanical strength comprises epoxy resin, curing agent, multidimensional composite dispersion liquid and reinforcing agent.

CHENG J, CHEN Y, ZHANG J

Self-healing and damage-in-situ recognition epoxy resin composite material useful for functional epoxy resin composite material, comprises epoxy resin matrix, curing agent, microcapsules loaded with epoxy resin repairing agent, and microcapsules loaded with thiol repairing agent.

BAI Y, HUANG Y, LIU L, LI J, WANG B, SHEN Y, YUAN W, HU Z

Graphene insole useful for e.g. full foot protection and safety shoes, comprises polyester polyol, polyether polyol, diisocyanate, glycerol, chain extender, graphene, water, silicone oil, amine additive, and diatomaceous earth.

GUO J, YANG Q, LI Z, YANG W

Wear-resistant heat-insulating polyurethane hard foam plastic comprises e.g. hydroxy terminated aromatic hyperbranched polyester, polymer polyol e.g. poly(1,4-butylene adipate), isocyanate e.g. isophorone diisocyanate, dibutyltin diacetate, composite filler e.g. fumed silica and azodicarbonamide.

CHEN Y, YOU C, LU Y

Phase-change hydrated salt polymerization filling material, comprises polyether polyol, foaming agent, flame retardant and heat conducting material, polymeric MDI and adhesive, polyether polyol, silicone oil and composite phase-change nano material.

ZHU Y, SHI C, LI J, LIU J, LIN Y, ZHANG P, XIN H

Polyimide precursor solution comprises modified silica microsphere, graphene oxide, diamine compound and dianhydride solution where modified silica microsphere is prepared by using silica powder as carrier, adding pure water under protection of inert gas to obtain initial product.

YUAN B