国家/地区 中国（41）
IPC部 C（41）
IPC大类 C08（41） B29（8） H01（6）
C09（5） D01（2）
IPC小类 C08K（41）
IPC C08K003/04（41）
发明人 ZHU Z（6） TANG B（4） TANG F（4）
CHEN J（3） CHEN J R（3） HSIEH C（3）
HSIEH C Y（3） HSIEH S（3） HSIEH S L（3）
LI Y（3） WU M Y（3） WU Y（3）
XIE C（3） XIE S（3） YANG X（3）
公开年 2015（41）
申请年 2015（29）  2014（12） 
专利权人 HEFEI KANGLI.（5） TONGLING SHE.（4） ANJU SCI TE.（3） CHEN J（3）
ENERAGE INC（3） HSIEH C（3） HSIEH S（3） WU M Y（3）
ANHUI JINYAN.（2） HUIZHOU KING.（2）

Method for enhancing fire resistance and thermal stability of polyvinyl chloride involves mixing (3-aminopropyl)triethoxysilane-coated graphene oxide suspension and polyvinyl chloride, ultrasonically-treating, drying and cooling.

DONG L, LONG H, ZHOU Z, MENG X

Flame-retardant rubber grafted graphene contains rubber matrix, vulcanizing agent, N-cylohexyl-2-benzothiazole sulfenamide, tetramethylthiuram disulfide, stearic acid, N-isopropyl-N'-phenyl-p-phenylenediamine and carbon black.

HU L, KANG P, WANG N, ZHANG J

Toughened benzoxazine composite material comprises benzoxazine resin, nylon 12 microspheres and benzoxazine monomer-modified graphene oxide.

LI Y, ZHAO C, SU H

Graphene polymer composite material used in electronic technologies e.g. semiconductor, comprises nano graphene sheet(s) dispersed in matrix resin and in contact with each other through filler, in specific weight ratio.

WU M Y, HSIEH C, CHEN J, HSIEH S, XIE S, WU Y, XIE C, HSIEH C Y, CHEN J R, HSIEH S L

Point, line, plane three-dimensional carbon material composite thermal conductive silica gel comprises surface-modified graphene, surface-modified carbon nanotubes and surface-modified carbon nanoparticles.

LI Y, ZHANG L

Multi-shaped functionalized graphene nanoribbons/thermoplastic polyurethane composite is obtained by reducing modified graphene oxide nanoribbons by hydrazine hydrate and molding layered functionalized graphene nanoribbons.

CAO N, LIN J, ZHENG Y, YIN H

Low-temperature resistant thermally-conductive fluorine rubber material comprises fluorine rubber, ethylene-propylene rubber, fumed silica, kaolin nanoparticles, modified graphene, microencapsulated red phosphorus and dioctyl sebacate.

CHEN X

High-dielectric polyimide composite film for load capacitor, contains vanadium pentoxide, expanded graphite, pyromellitic dianhydride, graphene, ethanol, hydroxyethyl methacrylate, polyvinyl alcohol, water and boric acid solution.

TANG B, TANG F

Capacitor with mixed microcrystalline glass powder loaded graphene comprises polyimide high dielectric composite film including polyacrylonitrile based carbon fiber powder, pyromellitic dianhydride, and 4,4-bis diaminodiphenyl ether.

TANG B, TANG F

High and low temperature heat conduction rubber material comprises e.g. fluorine rubber, silicone rubber, fumed silica, modified graphene, magnesium hydroxide nanoparticles, melamine phosphate, methylphosphonate and epoxidized soybean oil.

CHEN X